ExCom Committee

ExCom Chair: Huei Wang, National Taiwan University, Taiwan
ExCom Members
Jae-Sung Rieh, Korea University, Korea
Mohammad Madihian, Drexel University, USA
Wei Hong, Southeast University, China
Kamran Ghorbani, RMIT University, Australia
Noriharu Suematsu, Tohoku University, Japan
Goutam Chattopadhyay, NASA, USA

Organizing Committee

General Chair: Jae-Sung Rieh, Korea University
Technical Program Committee Chair: Minkyu Je, KAIST
Technical Program Committee Co-chair: Ho-Jin Song, POSTECH
Tutorial/Workshop Chair: Sanggeun Jeon, Korea University
Finance Chair: Hyunchul Ku, Konkuk University
Publications Chair: Wonbin Hong, POSTECH
Publicity Chair: Byung-Wook Min, Yonsei University
Local Arrangements Chair: Ockgoo Lee, Pusan National University
Exhibition Chair: Franklin Bien, UNIST
Award Chair: Jong-Ryul Yang, Yeungnam University

Technical Program Committee

Subcommittee (SC) NameAffiliationCountry
1. Frequency GenerationChairTaekwang JangETH ZürichSwitzerland
 Co-chairVadim IssakovTU BraunschweigGermany
  Heein YoonUNISTKorea
  Woorham BaeAyar LabsUSA
  Wooseok ChoiSeoul National UniversityKorea
  Pier Andrea FranceseIBM ZurichSwitzerland
  Lianbo WuBeihang UniversityChina
  Youngwoo JiETH Zürich, PostechSwitzerland
2. Power AmplifiersChairHyunchul ParkSamsung ElectronicsKorea
 Co-chairSaeid DaneshgarIntelUSA
  Dixian ZhaoSoutheast UniversityChina
  Yuuichi AokiSamsung ElectronicsKorea
  Youngoo YangSungkyunkwan UniversityKorea
  Hyejeong SongQualcommUSA
  Kazuaki KunihiroNECJapan
3. mm-Wave and THz CircuitsChairMunkyo SeoSungkyunkwan UniversityKorea
 Co-chairAhmed AhmedCairo UniversityEgypt
  Ali FaridIntel ResearchUSA
  Jinho JeongSogang UniversityKorea
  Jung-Dong ParkDongguk UniversityKorea
  Eunyoung SeokSamsung Research AmericaUSA
  Vamsi PaidiMaxlinearUSA
  Adam YoungTeledyne Scientific CompanyUSA
4. RF Front-End and Transceiver ICsChairIlku NamPusan National UniversityKorea
 Co-chairYiwu TangQualcommUSA
  Jusung KimHanbat National UniversityKorea
  Donggu ImJeonbuk National UniversityKorea
  Chuan WangQualcommUSA
  Bum-Kyum KimBroadcomUSA
5. Analog and Mixed-Signal ICsChairSang-Gyu ParkHanyang UniversityKorea
 Co-chairQiang LiUniversity of Electronic Science and Technology of ChinaChina
  Young-Ha HwangSoongsil UniversityKorea
  Moon-Kyu ChoKorea National University of TransportationKorea
  Jaeduk HanHanyang UniversityKorea
  Jun-Chau ChienNational Taiwan UniversityTaiwan
  Takesh YoshidaHiroshima UniversityJapan
6. Antenna and Packaging TechnologiesChairWonbin HongPOSTECHKorea
 Co-chairJung han ChoiFraunhofer InstituteGermany
  Jungseuk OhSeoul National UniversityKorea
  Yue Ping ZhangNanyang Technological UniversitySingapore
  Huan-Chu HuangVisionox Technology Co., Ltd.China
  Sangkil KimPusan National UniversityKorea
7. Sensor and Biomedical ICsChairSeong-Jin KimUNISTKorea
 Co-chairGao YuanInstitute of Microelectronics, A*STARSingapore
  Sung-Yun ParkPusan National UniversityKorea
  Hyung-Min LeeKorea UniversityKorea
  Sohmyung HaNYU Abu DhabiUAE
  Arup GeorgeDGISTKorea
  Yaoyao JiaUT AustinUSA
  Hao YuSUSTechChina
8. Wireless Power Transfer TechnologiesChairFranklin BienUNISTKorea
 Co-chairSai OrugantiJiangxi university of science and technology GanzhouChina
  Gangil ByunUNISTKorea
  Hyungho KoChung Nam Univ. (CNU)Korea
  Son Xuat TaHanoi University of Science and Technology (HUST)Vietnam
  Jaegon LeeKyungnam Univ.Korea
9. Emerging ICsChairJae-Yoon SimPOSTECHKorea
 Co-chairKenichi OkadaTokyo Institute of TechnologyJapan
  Makoto TakamiyaUniversity of TokyoJapan
  Bongjin KimUniversity of California, Santa BarbaraUSA
  Tae Wook KimYonsei UniversityKorea
  Ho-Jin SongPOSTECHKorea
10. Device Technologies, Modeling, and CADChairMyounggon KangKorea National University of TransportationKorea
 Co-chairJohn HuOklahoma State UniversityUSA
  Jooyoung JeonGangneung-Wonju National UniversityKorea
  Ickhyun SongHanyang UniversityKorea
  Jongwook JeonKonkuk UniversityKorea
  Zhenhua WuInstitute of Microelectronics, Chinese Academy of ScienceChina
  Saeed ZeinolabedinzadehArizona State UniversityUSA