• Device Technologies
CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS, reliability, characterization
• Modeling and CAD
active/passive device modeling, CAD, EM simulation, co-simulation, AI techniques for modeling and simulation
• Packaging Technology
MCM, SiP, TSV, flip-chip assembly, wire bonding, anisotropic conductive film
• Passive Circuits and Antenna
on-chip antennas, integrated passive devices, ferrite, piezoelectric material
• Frequency Generation and Conversion ICs
VCOs, PLLs, synthesizers, ADPLLs, frequency dividers/multipliers, mixers
• Front-end RFICs
LNAs, VGAs, phase shifters, RF switches
• Power ICs
power amplifiers, linearization circuits, drivers
• Millimeter-wave and THz ICs
circuits operating at mm-wave (30-300 GHz) and sub-mm-wave (>300 GHz) bands
• Analog and Mixed Signal ICs
ADCs, DACs, comparators, filters, VGAs, AGC
• High-Speed Data Transceivers
wireless/wireline/optical transceivers, CDRs for high-speed data links
• Power Transmission ICs
RFIDs, electric coupling, electromagnetic induction, magnetic resonance, wireless power transmission ICs
• Emerging ICs
power management, digital RF circuits/ architectures, RF BIST, reconfigurable and tunable ICs, automotive ICs, AI/ML-assisted communication ICs, quantum-computing ICs
• Radio-Integrated Systems
IoT/ M2M, automotive radars, wearable devices, security, biomedical and healthcare applications
• 5G/B5G/6G Systems
MIMO systems, smart radio systems, cube satellite and satellite communication systems